OSI Optoelectronics AS's space activity started in 1989 with a project from Officine Galileo (Florence, Italy) for a fully space qualified quadrant detector to fly on the ISO mission. This was the first space activity at OSI Optoelectronics AS since the former space division was separated out as an independent company in 1985 (now Alcatel Space). The successful completion of this contract resulted in a long relationship with Officine Galileo, and opened up for deliveries of space qualified optical detectors to other European customers such as Astrium and Tesat Spacecom. Expanding its territory, OSI Optoelectronics AS won in 2001 and 2002 contracts in Asia for non disclosed customers.

As a result, OSI Optoelectronics AS is today a well experienced European source for space qualified silicon based photo detectors. Since then, OSI Optoelectronics has extended its technology base towards InGaAs detectors. The first space related contract for this group of detectors was awarded in 2002.

OSI Optoelectronics's space qualified optical detectors may not necessarily be limited to products based on photodiode technology only. The wide experience in space product program management, packaging technology, environmental screening and testing, enables OSI Optoelectronics to manufacture and qualify products where the optical sensor element is supplied by a subcontractor. This includes sensor chips for other parts of the optical spectrum, and CMOS imaging sensor chips. OSI Optoelectronics flip-chip technology also enhance integrated detector products.

As reference, an overview of some of OSI Optoelectronics AS's space projects since 1989 is given below. Our optical detectors are mainly used for instrument payloads and platform control.

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Cryogenic quadrant detector for ISO mission 4-quadrant detector mounted in kovar package with sapphire window. Used in star sensor for alignment of the IR-telescope on the ISO mission. Operated at 2 K.

Opto-Hybrid for GOME I instrument on ERS1 mission Opto-hybrid for GOME I spectrometer. The detector chip has three active elements looking at the blue, visible and near infrared (NIR) part of the optical spectrum, respectively. Each element is connected to an amplifier channel with transimpedance approx. 1 GOhm. The hybrid also includes a reference chip with offset compensation and LED chips for in-flight functional check. Package sealed with lid with quartz window over the detector chip.

PIN diode for GIADA Mission Standard OSI Optoelectronics 4.5 x 4.5 mm2 PIN diode chip mounted on TO-8 header and coated with a space qualified resin. Complete assembly qualified for space flight.

Multi-element detector for VIRGO-LOI experiment on SOHO Detector custom made for the famous SOHO mission consisting of 12 elements within a circle. The detector is designed for ultra stable blue response and includes temperature sensor elements. It is used for mapping low frequency variations in the sun intensity.

Large area double strip detector flying on Russian PAMELA mission The detector was developed for nuclear particle detection and is used in the search of anti-matter on the PAMELA mission. Two chips with 16 elements each are mounted back-to back on a ceramic frame. The orthogonal alignment of front and back stripes enables position read out of detected particles.

Opto-hybrid for free space laser communication between satellites Opto hybrid consisting of 4-quadrant detector chip (frontside) and 4-channel transimpedance amplifier (backside of ceramic substrate). A 120 ±2 µm hole is etched through the center of the chip. A custom made kovar package is used to make possible the high precision assembly of the detector chip. The device is used for focusing a laser beam on an optical receiver placed behind the opto-hybrid.

Detector cell pairs for application in sun sensor Detector chip with two active areas mounted on ceramic substrate including a ceramic "garage" for protection of bonding wires. High volume project for platform control.

Detector cell pair for application in sun sensor Two 100 mm2 detector chips mounted on ceramic substrate. Micro-sheet for protection against UV-radiation glued on top of detector chips using space qualified resin. Assembly contacted by soldered cables.

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